Semiconductor contact barrier

ABSTRACT

System and method for reducing contact resistance and improving barrier properties is provided. An embodiment comprises a dielectric layer and contacts extending through the dielectric layer to connect to conductive regions. A contact barrier layer is formed between the conductive regions and the contacts by electroless plating the conductive regions after openings have been formed through the dielectric layer for the contact. The contact barrier layer is then treated to fill the grain boundary of the contact barrier layer, thereby improving the contact resistance. In another embodiment, the contact barrier layer is formed on the conductive regions by electroless plating prior to the formation of the dielectric layer.

This application is a continuation of U.S. patent application Ser. No.13/015,328 filed on Jan. 27, 2011, U.S. Pat. No. 8,294,274, and entitled“Semiconductor Contact Barrier,” which is a continuation of U.S. patentapplication Ser. No. 12/019,396 filed on Jan. 24, 2008, U.S. Pat. No.7,897,514, and entitled “Semiconductor Contact Barrier,” whichapplications are incorporated herein by reference.

TECHNICAL FIELD

The present invention relates generally to a system and method forforming electrical contacts and, more particularly, to a system andmethod for forming a barrier layer for electrical contacts.

BACKGROUND

In the race to improve transistor performance as well as to reduce thesize of transistors, much research has been done on the contacts thatconnect a transistor's source and drain regions to the various layers ofmetallization over the transistor. In the search for better contacts,copper has been researched as a potential method to improve theresistance of the contact, as well as the overall performance of thedevice as a whole. However, the use of copper has some inherent problemsthat must be overcome, such as copper's propensity to migrate and causeunwanted reactions with other materials.

FIG. 1 illustrates one attempt to overcome some of these problems ofusing copper as a contact. FIG. 1 illustrates a substrate 101 withshallow trench isolation (STI) 103, and a device 100 formed on thesubstrate 101. The device 100 comprises a gate dielectric 105, gateelectrode 107, spacers 109, source/drain regions 111, and silicidecontacts 113. An inter-layer dielectric (ILD) 115 covers the device 100.Openings are formed in the ILD 115, and contact barrier layers 117, madeof a material such as cobalt tungsten phosphide (CoWP), are formed onthe silicide contacts 113. A barrier layer 119 is then formed in theopenings and the openings are overfilled with copper 121, planarized bya method such as CMP, and connected to later formed metal lines 123within a dielectric layer 125. The contact barrier layers 117 help toreduce the contact resistance and prevent the copper 121 from migratingand reacting with the silicide contacts 113.

However, this solution, while an improvement over previous methods, doesnot by itself solve the problems with using copper as a contact. Certainproperties of the contact barrier layers 117 need further improvementfor its full application in devices. For example, the contact barrierlayers 117 formed as described above have grain boundaries at theirinterfaces with other materials that are unfilled. These unfilled grainboundaries increase the potential contact resistance, making thissolution less desirable.

Because of these and other problems associated with the current methods,what is needed is a contact barrier that has improved properties tolower the contact resistance of the contact and work to prevent copperfrom migrating and having unwanted reactions with adjacent layers.

SUMMARY OF THE INVENTION

These and other problems are generally solved or circumvented, andtechnical advantages are generally achieved, by preferred embodiments ofthe present invention that provide a structure and method for formingcontacts to conductive regions of a semiconductor device.

One aspect of the present invention involves a method of forming acontact. The method includes forming a conductive region and thenforming a dielectric layer over the conductive region. At least oneopening is formed through the dielectric layer to the conductive region,and a contact barrier layer of a first material is selectively formed atthe bottom of the opening and in contact with the conductive region. Thecontact barrier layer is then treated to form a second material, and thecontact is completed by filling the opening with a conductive material.

Another aspect of the present invention involves a method of forming acontact to a conductive region. A conductive region is provided and adielectric layer is formed over the conductive region. A conductive plugis formed through the dielectric layer over the conductive region, and atreated conductive layer is formed interposed between the conductiveregion and the conductive plug.

Yet another aspect of the present invention involves a method forconnecting two conductive regions through a dielectric layer. Thismethod comprises providing a conductive region and selectively forming acontact barrier layer of a first material on the exposed regions of theconductive region, and then transforming at least a portion of the firstmaterial into a second material by introducing impurities. A dielectriclayer is formed over the conductive region, and an opening is formedthrough the dielectric layer over at least a portion of the conductiveregion, and the opening is filled with conductive material.

Yet another aspect of the present invention involves a semiconductordevice comprising a first conductive layer and a dielectric layer overthe first conductive layer. An opening is located through the dielectriclayer to the first conductive layer, the opening comprising sidewallsand a bottom. A treated conductive material is within the opening, thetreated conductive material located along the bottom of the opening andin contact with the first conductive layer. A conductive material islocated along the sidewalls of the opening and over the treatedconductive material.

Yet another aspect of the present invention involves a semiconductordevice comprising a conductive region with a top surface and a firstgrain-filled conductive barrier layer over substantially the entire topsurface of the conductive region. A dielectric layer is over the firstgrain-filled conductive barrier layer and a conductive material extendsthrough the dielectric layer and in contact with the first conductivebarrier layer.

Yet another aspect of the present invention involves a semiconductordevice comprising a transistor having a conductive region and a firstsilicide region over the conductive region. A dielectric layer is overthe silicide region and a first conductive material extends through thedielectric layer and is in electrical contact with the silicide region,the first conductive material in contact with at least a portion of thedielectric layer. A first treated barrier is between the silicide regionand the first conductive material.

Yet another aspect of the present invention involves a semiconductordevice comprising a first conductive region in a substrate, a first gateelectrode over the substrate, and a first treated conductive material inphysical contact with the first conductive region. A second treatedconductive material is in physical contact with the first gateelectrode, and a dielectric layer is over the first conductive regionand over the first gate electrode. A first contact extends through thedielectric layer and making electrical contact with the first treatedconductive material.

Yet another aspect of the present invention involves a semiconductordevice comprising a conductive region in a substrate and a firstgrain-filled conductive region in physical contact with a surface of theconductive region. A contact is in physical connection with the firstgrain-filled conductive region.

Yet another aspect of the present invention involves a method ofmanufacturing a semiconductor device comprising forming a firstconductive region within a substrate and depositing a second conductiveregion over the first conductive region, the second conductive regionhaving a grain boundary. The grain boundary of the second conductiveregion is filled to form a grain-filled conductive material. Adielectric material is deposited over the first conductive region, and aportion of the dielectric material is removed to form an opening. Aconductive material is placed in the opening to make electrical contactwith the grain-filled conductive material.

By using these methods to form the contacts described, the contactresistance between the contact and the region to be contacted can bereduced. This will result in an overall reduction in the resistance ofthe device, and, accordingly, better performance of the device.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawings, in which:

FIG. 1 illustrates a prior art device with untreated contact barrierlayers;

FIGS. 2-8 illustrate intermediate steps in the formation of contactbarrier layers and contacts in accordance with an embodiment of thepresent invention;

FIG. 9 illustrates contact barrier layers in contact with a portion of asilicide region in accordance with an embodiment of the presentinvention; and

FIGS. 10-11 illustrate contact barrier layers in contact withsubstantially all of the silicide region in accordance with anembodiment of the present invention.

Corresponding numerals and symbols in the different figures generallyrefer to corresponding parts unless otherwise indicated. The figures aredrawn to clearly illustrate the relevant aspects of the preferredembodiments and are not necessarily drawn to scale.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

The making and using of the presently preferred embodiments arediscussed in detail below. It should be appreciated, however, that thepresent invention provides many applicable inventive concepts that canbe embodied in a wide variety of specific contexts. The specificembodiments discussed are merely illustrative of specific ways to makeand use the invention, and do not limit the scope of the invention.

The present invention will be described with respect to forming acontact barrier layer to the source/drain regions of a field effecttransistor. The invention may also be applied, however, to othercontacts and vias such as those found through an interlayer dielectriclayer.

With reference now to FIG. 2, there is shown a transistor 200 formed ona substrate 201 with shallow trench isolations (STIs) 203 formedtherein. The transistor 200 generally comprises a gate dielectric 205,gate electrode 207, spacers 209, source/drain regions 211, and silicidecontacts 213.

The substrate 201 may comprise bulk silicon, doped or undoped, or anactive layer of a silicon-on-insulator (SOI) substrate. Generally, anSOI substrate comprises a layer of a semiconductor material such assilicon, germanium, silicon germanium, SOI, silicon germanium oninsulator (SGOI), or combinations thereof Other substrates that may beused include multi-layered substrates, gradient substrates, or hybridorientation substrates.

The STIs 203 are generally formed by etching the substrate 201 to form atrench and filling the trench with a dielectric material as is known inthe art. Preferably, the STIs 203 are filled with a dielectric materialsuch as an oxide material, a high-density plasma (HDP) oxide, or thelike, formed by conventional methods known in the art.

Gate dielectric 205 and gate electrode 207 may be formed and patternedon the substrate 201 by any suitable process known in the art. The gatedielectric 205 is preferably a high-K dielectric material, such assilicon oxide, silicon oxynitride, silicon nitride, an oxide, anitrogen-containing oxide, aluminum oxide, lanthanum oxide, hafniumoxide, zirconium oxide, hafnium oxynitride, a combination thereof, orthe like. Preferably, the gate dielectric 205 has a relativepermittivity value greater than about 4.

In an embodiment in which the gate dielectric 205 comprises an oxidelayer, the gate dielectric 205 may be formed by any oxidation process,such as wet or dry thermal oxidation in an ambient comprising an oxide,H₂O, NO, or a combination thereof, or by chemical vapor deposition (CVD)techniques using tetra-ethyl-ortho-silicate (TEOS) and oxygen as aprecursor. In one embodiment, the gate dielectric 205 is between about 8Å to about 50 Å in thickness, and is preferably about 16 Å in thickness.

The gate electrode 207 preferably comprises a conductive material, suchas a metal (e.g., tantalum, titanium, molybdenum, tungsten, platinum,aluminum, hafnium, ruthenium), a metal silicide (e.g., titaniumsilicide, cobalt silicide, nickel silicide, tantalum silicide), a metalnitride (e.g., titanium nitride, tantalum nitride), dopedpoly-crystalline silicon, other conductive materials, or a combinationthereof. In one example, amorphous silicon is deposited andrecrystallized to create poly-crystalline silicon (poly-silicon). In anembodiment in which the gate electrode 207 is poly-silicon, the gateelectrode 207 may be formed by depositing doped or undoped poly-siliconby low-pressure chemical vapor deposition (LPCVD) to a thickness in therange of about 100 Å to about 2,500 Å, but more preferably about 1,500Å.

Spacers 209 are formed on the sidewalls of the gate dielectric 205 andthe gate electrode 207. The spacers 209 are typically formed by blanketdepositing a spacer layer (not shown) on the previously formedstructure. The spacer layer preferably comprises SiN, oxynitride, SiC,SiON, oxide, and the like, and is preferably formed by commonly usedmethods such as chemical vapor deposition (CVD), plasma enhanced CVD,sputter, and other methods known in the art. The spacer layer is thenpatterned to form the spacers 209, preferably by anisotropically etchingto remove the spacer layer from the horizontal surfaces of thestructure.

Source/drain regions 211 are formed in the substrate 201 on opposingsides of the gate dielectric 205. In an embodiment in which thesubstrate 201 is an n-type substrate, the source/drain regions 211 arepreferably formed by implanting appropriate p-type dopants such asboron, gallium, indium, or the like. Alternatively, in an embodiment inwhich the substrate 201 is a p-type substrate, the source/drain regions211 may be formed by implanting appropriate n-type dopants such asphosphorous, arsenic, or the like. These source/drain regions 211 areimplanted using the gate dielectric 205, gate electrode 207 and the gatespacers 209 as masks.

It should be noted that one of ordinary skill in the art will realizethat many other processes, steps, or the like may be used to form thesesource/drain regions 211. For example, one of ordinary skill in the artwill realize that a plurality of implants may be performed using variouscombinations of spacers and liners to form source/drain regions having aspecific shape or characteristic suitable for a particular purpose. Anyof these processes may be used to form the source/drain regions 211, andthe above description is not meant to limit the present invention to thesteps presented above.

Optionally, silicide contacts 213 are formed from a portion of thesource/drain regions 211 and the gate electrode 207. The silicidecontacts 213 preferably comprise nickel. However, other commonly usedmetals, such as titanium, cobalt, palladium, platinum, erbium, and thelike, can also be used. As is known in the art, the silicidation ispreferably performed by blanket deposition of an appropriate metallayer, followed by an annealing step in which the metal reacts with theunderlying exposed silicon. Unreacted metal is then removed, preferablywith a selective etch process. The thickness of the silicide contacts213 is preferably between about 3 nm and about 50 nm, with a preferredthickness of about 10 nm. Alternatively, the silicide contacts 213 maybe left off, leaving only the substrate 201 as the point of contact, orelse a metal layer (not shown) may be formed to serve as the contactpoint for the source/drain regions 211.

FIG. 3 illustrates the formation of an inter-layer dielectric (ILD) 301over the transistor 200. The ILD 301 may be formed by chemical vapordeposition, sputtering, or any other methods known and used in the artfor forming an ILD 301. The ILD 301 typically has a planarized surfaceand may be comprised of silicon oxide, although other materials, such asother high-k materials, could alternatively be utilized.

FIG. 4 illustrates the formation of openings 401 through the ILD 301 tothe silicide contacts 213. Openings 401 may be formed in the ILD 301 inaccordance with known photolithography and etching techniques.Generally, photolithography techniques involve depositing a photoresistmaterial, which is masked, exposed, and developed to expose portions ofthe ILD 301 that are to be removed. The remaining photoresist materialprotects the underlying material from subsequent processing steps, suchas etching. In the preferred embodiment, photoresist material isutilized to create a patterned mask to define openings 401, butadditional masks, such as a hardmask, may also be used. The etchingprocess may be an anisotropic or isotropic etch process, but preferablyis an anisotropic dry etch process. In a preferred embodiment, the etchprocess is continued until at least a portion of the silicide contacts213 are exposed.

FIG. 5 illustrates the formation of contact barrier layers 501 on theexposed portions of the silicide contacts 213 within openings 401. If nosilicide contacts 213 are being used, the contact barrier layers 501 arepreferably formed on either the substrate or the metal layer, whicheverhas been chosen as the point of contact for the source/drain regions211. In the preferred embodiment, contact barrier layers 501 areselectively formed by electroless plating. As the silicide contacts 213are conductive and the ILD 301 is not conductive, contact barrier layers501 will be formed only on silicide contacts 213, and no contact barrierlayer 501 is formed on the top surface of the ILD 301.

Contact barrier layers 501 are preferably formed of cobalt tungsten(CoW). However, other materials, such as cobalt tungsten phosphide(CoWP), cobalt tungsten boride (CoWB), combinations of these, or thelike, could alternatively be used. Contact barrier layers 501 arepreferably formed with a thickness of between about 5 nm and about 50nm, with a preferred thickness of about 20 nm.

FIG. 6 illustrates a further treatment of the contact barrier layers501. The contact barrier layers 501 are treated so as to substantiallyfill the grain boundary of the contact barrier layers 501 and form agrain-filled contact barrier layers 501. This treatment is preferablyperformed using, either individually or in combination, silane (SiH₄),germane (GeH₄), or ammonia (NH₃), although other materials, such as C₂H₄or CH₄ may alternatively be used. This treatment of the contact barrierlayers 501 works to fill the grain boundary of the contact barrierlayers 501, thereby improving the contact resistance between thesilicide contacts 213 and the later-formed contacts (whose formation isfurther described below with reference to FIGS. 7-8) and furtherprevents migration through the contact barrier layers 501.

The treatment is preferably performed by a plasma treatment. In thisplasma treatment the contact barrier layers 501 are exposed to a plasmaof silane, germane, or ammonia, either individually or in combination asdescribed above, at a pressure of between about 0.1 torr and about 100ton, and a preferred pressure of about 4 ton, and at a temperature ofbetween about 200° C. and about 450° C., and a preferred temperature ofabout 400° C. Additionally, the plasma treatment is preferably performedat an excitation frequency of between about 0.1 MHz and about 10 MHz,with a preferred frequency of about 2 MHz, and a power of between about200 W and about 1200 W, with a preferred power of about 600 W. However,other treatment processes, such as C₂H₄ or CH₄ may alternatively beused.

The treatment of the contact barrier layers 501 will form differentmaterials depending upon the starting material of the contact barrierlayers 501 as well as which materials are used to treat the contactbarrier layers 501. For example, if the contact barrier layers 501 areinitially formed with CoW, the treated contact barrier layers 501 may beCoWGe, CoWSi, CoWGeN, CoWSiN, or CoWGeSiN, depending on whether thetreatment was performed with germane, silane, germane and ammonia,silane and ammonia, or silane and germane and ammonia, respectively. Asa further example, if the contact barrier layers 501 are initiallyformed using CoWP, the treated contact barrier layers 501 may be CoWPGe,CoWPSi, CoWGePN, CoWPSiN, or CoWPGeSiN, depending on whether thetreatment was performed with germane, silane, germane and ammonia,silane and ammonia, or silane and germane and ammonia, respectively. Asanother example, if the contact barrier layers 501 are initially formedusing CoWB, the treated contact barrier layers 501 may be CoWBGe,CoWBSi, CoWGeBN, CoWBSiN, or CoWBGeSiN, depending on whether thetreatment was performed with germane, silane, germane and ammonia,silane and ammonia, or silane and germane and ammonia, respectively.However, while these examples are listed for convenience, this list ismeant for illustrative purposes only and is not meant to be exclusive ofother possible combinations. All combinations that may be formed fromtreating the contact barrier layers to fill the grain boundary are fullyintended to be within the scope of the present invention.

FIG. 7 illustrates the formation of a diffusion barrier layer 701 and aconductive material 703. Diffusion barrier layer 701 is preferablyformed through a blanket formation that covers the sidewalls and bottomsof openings 401 over the contact barrier layer 501. Diffusion barrierlayer 701 is preferably formed of a material comprising titanium,titanium nitride, tantalum, tantalum nitride, ruthenium, rutheniumnitride, titanium compound, tantalum compound, or combinations thereof.The preferred formation methods include physical vapor deposition (PVD),atomic layer deposition (ALD), and other commonly used methods.

A seed layer (not shown), which preferably includes copper or copperalloys, is preferably formed on the diffusion barrier layer 701. Aconductive material 703 is then filled into openings 401, preferablyusing plating. Conductive material 703 preferably comprises copper orcopper alloys, although other materials such as aluminum, tungsten,silver, or combinations thereof, can also be used.

FIG. 8 illustrates the formation of contacts 801 to the silicidecontacts 213. Preferably, a chemical mechanical polish (CMP) isperformed to remove excess materials, and the top surface of theconductive material 703 and diffusion barrier layer 701 is reduced untillevel with a top surface of the ILD 301. As a result, only the materialwithin openings 401 remain, and contacts 801 are formed.

FIG. 9 illustrates the formation of metal lines 903 connected to thecontacts 801. A preferred method for forming the metal lines 903 is thedamascene method. Generally, this method involves forming a dielectriclayer 901 and then forming openings in the dielectric layer 901. Theopenings are typically formed using conventional lithographic andetching techniques as discussed above. After the openings are formed,the openings are filled with copper or copper alloys to form the metallines 903. Excess metal material on the surface of the dielectric layer901 is then removed by a planarization process, such as chemicalmechanical planarization (CMP).

Additionally, while not explicitly shown in the Figures, it should beunderstood that the process described above (with respect to FIGS. 2-9)to make a contact barrier layer 501 over a source/drain region 211 mayalso be used to form a contact barrier layer 501 on the gate electrode207 or any other conductive contact, such as a via. This process wouldoccur at a different cross section than that shown in FIGS. 2-9, but theformation of a contact 801 to the gate electrode 207 is fully intendedto be included within the scope of the present invention.

FIG. 10 illustrates another embodiment of the present invention in whichthe contact barrier 501 is formed prior to the deposition of the ILD301. In this embodiment, after the formation of the silicide contacts213 and prior to the deposition of the ILD 301, electroless plating isperformed (preferably as described above with reference to FIG. 5) so asto form the contact barrier layers 501 on the conductive regions of thetransistor 200. This procedure forms the contact barrier layers 501 onsubstantially all of the silicide contacts 213 above the source/drainregions 211 and also on the silicide contacts 213 above the gateelectrode 207.

Once the contact barrier layers 501 have been formed, the contactbarrier layers 501 are then treated in a similar fashion as describedabove with reference to FIG. 6. The treatment is preferably performedprior to the formation of the ILD 301, thereby treating substantiallyall of the exposed contact barrier layers 501. Alternatively, the ILD301 and openings 401 may be formed as described above with reference toFIGS. 3 and 4 prior to the treatment of the exposed portions of thecontact barrier layers 501, thereby allowing only a portion of thecontact barrier layers 501 to be treated. Each of these methods isintended to be included within the scope of the present invention.

FIG. 11 illustrates the formation of the remainder of the contacts 801in this embodiment. The ILD 301 (if not already formed), barrier layers701, conductive overfill 703, contacts 801, and metal lines 903 arepreferably formed as described above with reference to FIGS. 2-9 tocomplete the formation of the contacts 801. However, in this embodiment,the contacts 801 are only in contact with a portion of the top of thecontact barrier layers 501, instead of in contact with substantially theentire top surface of the contact barrier layers 501.

Although the present invention and its advantages have been described indetail, it should be understood that various changes, substitutions andalterations can be made herein without departing from the spirit andscope of the invention as defined by the appended claims. For example,there are multiple methods for the deposition of material as thestructure is being formed. Any of these deposition methods that achievesubstantially the same result as the corresponding embodiments describedherein may be utilized according to the present invention.

Moreover, the scope of the present application is not intended to belimited to the particular embodiments of the methods described in thespecification. As one of ordinary skill in the art will readilyappreciate from the disclosure of the present invention, methodspresently existing, or later to be developed, that perform substantiallythe same function or achieve substantially the same result as thecorresponding embodiments described herein may be utilized according tothe present invention. Accordingly, the appended claims are intended toinclude within their scope such methods.

What is claimed is:
 1. A semiconductor device comprising: a firstconductive region in a substrate; a first gate electrode over thesubstrate; a first treated conductive material in a physical contactwith the first conductive region; a second treated conductive materialin a physical contact with the first gate electrode; a dielectric layerover the first conductive region and over the first gate electrode; anda first contact extending through the dielectric layer and making anelectrical contact with the first treated conductive material.
 2. Thesemiconductor device of claim 1, wherein the second treated conductivematerial comprises a material selected from the group consistingessentially of CoWGe, CoWSi, CoWGeN, or CoWSiN.
 3. The semiconductordevice of claim 1, wherein the second treated conductive materialcomprises a material selected from the group consisting essentially ofCoWPGe, CoWPSi, CoWGePN, CoWPSiN, or CoWPGeSiN.
 4. The semiconductordevice of claim 1, wherein the second treated conductive materialcomprises a material selected from the group consisting essentially ofCoWBGe, CoWBSi, CoWGeBN, CoWBSiN, or CoWBGeSiN.
 5. The semiconductordevice of claim 1, wherein the second treated conductive materialcomprises silicon.
 6. The semiconductor device of claim 1, wherein thesecond treated conductive material comprises germanium.
 7. Thesemiconductor device of claim 1, wherein the second treated conductivematerial comprises nitrogen.
 8. The semiconductor device of claim 1,wherein the gate electrode further comprises a silicide region adjacentto the second treated conductive material.
 9. The semiconductor deviceof claim 1, wherein the first conductive region is part of a substratewith source/drain regions located therein.
 10. A semiconductor devicecomprising: a conductive region in a substrate; a first grain-filledconductive region in a physical contact with a surface of the conductiveregion; and a contact in physical connection with the first grain-filledconductive region.
 11. The semiconductor device of claim 10, wherein thefirst grain-filled conductive region comprises a material selected fromthe group consisting essentially of CoWGe, CoWSi, CoWGeN, or CoWSiN. 12.The semiconductor device of claim 10, wherein the first grain-filledconductive region comprises a material selected from the groupconsisting essentially of CoWPGe, CoWPSi, CoWGePN, CoWPSiN, orCoWPGeSiN.
 13. The semiconductor device of claim 10, wherein the firstgrain-filled conductive region comprises a material selected from thegroup consisting essentially of CoWBGe, CoWBSi, CoWGeBN, CoWBSiN, orCoWBGeSiN.
 14. The semiconductor device of claim 10 further comprising atransistor, wherein the transistor comprises: the conductive region; agate dielectric adjacent to the conductive region; a gate electrode overthe gate dielectric; and a second grain-filled conductive region overthe gate electrode.
 15. A method of manufacturing a semiconductordevice, the method comprising: forming a first conductive region withina substrate; depositing a second conductive region over the firstconductive region, the second conductive region having a grain boundary;filling the grain boundary of the second conductive region to form agrain-filled conductive material; depositing a dielectric material overthe first conductive region; removing a portion of the dielectricmaterial to form an opening; and placing a conductive material in theopening to make an electrical contact with the grain-filled conductivematerial.
 16. The method of claim 15, wherein the second conductiveregion comprises a material selected from the group consistingessentially of CoW, CoWB, or CoWP.
 17. The method of claim 15, whereinthe filling the grain boundary is performed at least in part by treatingwith silane.
 18. The method of claim 15, wherein the filling the grainboundary is performed at least in part by treating with ammonia.
 19. Themethod of claim 15, wherein the filling the grain boundary is performedat least in part by treating with germane.
 20. The method of claim 15,wherein the filling the grain boundary is performed at least in part bytreating with a combination of silane, germane and ammonia.